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          3D Industrial Image Analysis Application



          3D Particle Measurement

              Analyze the structure of nano-/micro particles including voids and foreign particles in TEM or X-ray CT images, to measure the distribution of material elements.


Main features
Using the CT images comprising structures of voids and foreign particles, eparate and display substrate and particles.
Separate detached particles 3-dimentionally to display them in different colors.
Apply measurements to each detached particle in the specified area, to obtain the volume, surface area, aspect ratio, and their distribution etc.
Export measurement results to a csv file.
Export the hexahedron mesh data of substrate structure within the specified region for FEM simulation.


Using 3D image processing, extract and separate particles. To the area in which particles cannot be separated automatically, 3D interpolation method is effective.

Main measurement items

Volume
Sphere diameter
Diameter of inertia elliptical body 2a, 2b, 2c
3D particle density distribution in-depth
Barycentric coordinate

Long axis direction
Surface area
Coordination number
Distance between particles etc.



         Fiber Material Orientation Analysis

              Based on X-ray or TEM CT images of 3D structure, analyze fiber or grass fiber in a sample, to obtain the features of lineament, such as length, width, orientation, distribution and so on.


Main features
Extract fiber or acerous particle.
Separate each linear object overlapped 3-dimensionally.
Display each fiber in different colors.


Measurement Items

Fiber length and its distribution
Fiber width and its distribution
Orientation and its direction
Local orientation and its distribution
Center of gravity
Dispersity etc.

              Communicating Hole Measurement

              Based on X-ray or TEM CT images of a 3D madreporite structure, extract communicating holes in a sample, to measure their length and width, contact cross section area of connecting bodies and so on.


Main features
Extract communicating holes
Extract a connecting void network, to display in different colors.
Display the specified communicating hole network. Display cross-section cutting movie of an object.
Measure the cross section area of communicating hole network directly.
Divide voids into paths between connecting nodes, to measure the smallest cross section area shape and length of each path.
Measure the length and width of communicating voids.
Measure the conduction index of flow path between specified two points.
Measure cohesion degree within void substrate structure.


 



Measurement items of conduction index of flow path

Display the skeletons of communicating voids.
Quantify "conduction index" of communicating voids.
Display the 3D shape of tissue outline.
Extract the optimal path from arbitrary cross section A to B.
In combination with TRI/3D-PRT, separate each conduction madreporite, to measure its volume, surface area, anisotropy, contact cross section area and their distribution.  



              Rubber Void Analysis

              Analyze X-ray CT images of a structure including particles such as air holes, to measure the distribution of material components.


Volume distribution


Particle asbestos ratio c/a
a : Length of elliptical body long axis
c : Length of elliptical body short axis


Air hole

Particle density distribution in-depth

              Non-contact distortion meter

              It determined quantity of distortion of the work for the load of the tensile testing equipment by microscope image measurement Automatically track the position changes of the feature points that have been specified in the microscope field of view, and then output to a CSV file on the image coordinate values of feature points with the time. The measurement by conventional strain gauges have been made is not needed.


Main Specifications

Two points of strain measurement
Center distance point strain measurement:35mm
Microscopic field of vision size : Approximate 600μm×480μm
Position measurement accuracy : Less than 3μm(Less than 0.01% of the distance)
Quantity of Maximum displacement : The operation range is in the field of vision(Minimum 300μm 〜 Maximum 600μm)
Measurement interval : 0.1 seconds or less

 



Four-point strain measurement
Distance between the strain measurement center: 50μm It is the same as two points of distortion measurement as follows
Microscope objective lens: 10×、20×
Image input: Number of pixels 640×480
Monochrome CCD camera
OS: WindowsNT/2000