|3D Industrial Image Analysis Application|
3D Particle Measurement
Analyze the structure of nano-/micro particles including voids and foreign particles in TEM or X-ray CT images, to measure the distribution of material elements.
Main featuresUsing the CT images comprising structures of voids and foreign particles, eparate and display substrate and particles.
Separate detached particles 3-dimentionally to display them in different colors.
Apply measurements to each detached particle in the specified area, to obtain the volume, surface area, aspect ratio, and their distribution etc.
Export measurement results to a csv file.
Export the hexahedron mesh data of substrate structure within the specified region for FEM simulation.
Using 3D image processing, extract and separate particles. To the area in which particles cannot be separated automatically, 3D interpolation method is effective.
Main measurement items
Fiber Material Orientation Analysis
Based on X-ray or TEM CT images of 3D structure, analyze fiber or grass fiber in a sample, to obtain the features of lineament, such as length, width, orientation, distribution and so on.
Main featuresExtract fiber or acerous particle.
Separate each linear object overlapped 3-dimensionally.
Display each fiber in different colors.
Fiber length and its distribution
Fiber width and its distribution
Orientation and its direction
Local orientation and its distribution
Center of gravity
Communicating Hole Measurement
Based on X-ray or TEM CT images of a 3D madreporite structure, extract communicating holes in a sample, to measure their length and width, contact cross section area of connecting bodies and so on.
Main featuresExtract communicating holes
Extract a connecting void network, to display in different colors.
Display the specified communicating hole network. Display cross-section cutting movie of an object.
Measure the cross section area of communicating hole network directly.
Divide voids into paths between connecting nodes, to measure the smallest cross section area shape and length of each path.
Measure the length and width of communicating voids.
Measure the conduction index of flow path between specified two points.
Measure cohesion degree within void substrate structure.
Measurement items of conduction index of flow path
Display the skeletons of communicating voids.
Quantify "conduction index" of communicating voids.
Display the 3D shape of tissue outline.
Extract the optimal path from arbitrary cross section A to B.
In combination with TRI/3D-PRT, separate each conduction madreporite, to measure its volume, surface area, anisotropy, contact cross section area and their distribution.
Rubber Void Analysis
Analyze X-ray CT images of a structure including particles such as air holes, to measure the distribution of material components.
Particle asbestos ratio c/a
a : Length of elliptical body long axis
c : Length of elliptical body short axis
Particle density distribution in-depth
Non-contact distortion meter
It determined quantity of distortion of the work for the load of the tensile testing equipment by microscope image measurement Automatically track the position changes of the feature points that have been specified in the microscope field of view, and then output to a CSV file on the image coordinate values of feature points with the time. The measurement by conventional strain gauges have been made is not needed.
★Two points of strain measurement
・Center distance point strain measurement：35mm
・Microscopic field of vision size : Approximate 600μｍ×480μm
・Position measurement accuracy : Less than 3μｍ（Less than 0.01% of the distance）
・Quantity of Maximum displacement : The operation range is in the field of vision（Minimum 300μｍ 〜 Maximum 600μｍ）
・Measurement interval : 0.1 seconds or less
★Four-point strain measurement
・ Distance between the strain measurement center: 50μm It is the same as two points of distortion measurement as follows
★Microscope objective lens: 10×、20×
★Image input: Number of pixels 640×480
★Monochrome CCD camera